Method for making heat dissipation device

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United States of America Patent

PATENT NO 6665934
SERIAL NO

10037853

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Abstract

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A method for making a heat dissipation device (3) includes the steps of: providing a metal plate (2) and a fin member (1), bending the metal plate to form a body (2'), and attaching the fin member to the body. The metal plate includes a central portion (22) and a pair of end portions (24). The central portion is thicker than the end portions. The body includes a chassis (22') originating from the central portion of the metal plate, and a pair of side walls (24') originating from the end portions of the metal plate. The fin member is attached to the chassis between the side walls.

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Patent Owner(s)

Patent OwnerAddress
FOXCONN PRECISION COMPONENTS CO LTD66-1 CHUNG-SHAN ROAD TU-CHEN TAIPEI HSIEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lo, Wei Ta Taipei, TW 9 55

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