Reworkable thermosetting resin compositions
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United States of America Patent
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Dec 2, 2003
Grant Date -
N/A
app pub date -
Jul 31, 2001
filing date -
Aug 2, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This invention relates to thermosetting resin compositions useful for mounting semiconductor devices onto a circuit board, such as chip size or chip scale packages ('CSPs'), ball grid arrays ('BGAs'), land grid arrays ('LGAs'), and the like, each of which having a semiconductor chip, such as large scale integration ('LSI'), on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.
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