Hot melt pressure sensitive positioning adhesive (III)
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 2, 2003
Grant Date -
N/A
app pub date -
Jun 20, 2000
filing date -
Jun 25, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention is a hot melt pressure sensitive positioning adhesive for use with an absorbent article. The adhesive comprises: (a) from 5 to less than 15 percent by weight of a blend of (i) a hydrogenated styrene-(butadiene or isoprene)-styrene block copolymer having a polystyrene block number average molecular weight of 20,000 or less, and (ii) a homogeneous linear or substantially linear interpolymer of ethylene and at least one C.sub.3 -C.sub.20 alpha olefin having a density from 0.85 to 0.91 grams per cubic centimeter; and (b) from 50 to 80 percent by weight of a tackifying resin which has an aromaticity such that the MMAP cloud point is at least 45.degree. C.; and (c) from 5 to 35 percent by weight of a plasticizing oil. The block copolymer of (i) may also be one in which the polystyrene block molecular weight is greater than 20,000. In such case, the tackifying resin must have an aromaticity wherein the MMAP cloud point is at least 70.degree. C.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully