Computer heat dissipating structure
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United States of America Patent
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Nov 25, 2003
Grant Date -
N/A
app pub date -
Oct 3, 2002
filing date -
Oct 2, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A computer heat dissipating structure of the invention is mounted over a computer main board inside a computer principal unit to dissipate the heat irradiated by at least a principal heat source and a secondary heat source. The computer heat dissipating structure comprises a heat sink that is mounted on the principal heat source, and a fan that is mounted at one lateral side of the heat sink. The fan includes an outer casing that has a lower casing body made of a material having good thermal conduction characteristics. The outer casing further includes an airflow inlet and an airflow outlet that is connected to the heat sink, the lower casing body being placed on the secondary heat source. Via a separate mount of the heat sink and the fan, a lateral blow vis-a-vis the heat sink is thereby achieved to improve the simultaneous heat dissipation of two heat sources.
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