Semiconductor die pad placement and wire bond
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United States of America Patent
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Nov 25, 2003
Grant Date -
N/A
app pub date -
Jul 14, 1998
filing date -
Jul 14, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device is provided comprising a die. A first set of plural components, other than interface components, are located on the die surface. A first conductor located on the die surface connects to each component of the first set. A second set of plural components, other than said interface components, are located on the die surface. A second conductor located on the die surface connects to each component of the second set. A bonding pad is located on the die surface such that the first set of components lie between the bonding pad and an edge of the die and the second set of components lie between the bonding pad and an opposing edge of the die. The bonding pad is for receiving or transmitting one or more signals via the first and second conductors. At least one lead frame finger extends to an edge of the die but does not overlie the die. A bonding wire connects the at least one finger to the bonding pad.
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