Multi-layered substrate with a built-in capacitor design and a method of making the same
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United States of America Patent
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Nov 25, 2003
Issued Date -
N/A
app pub date -
Aug 23, 2001
filing date -
May 16, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A multi-layered substrate having built-in capacitors is disclosed. The substrate comprises at least one high permittivity of dielectric material filled in the through holes between the power plane and the ground plane so as to form capacitors. The built in capacitors are to decouple high frequency noise due to the voltage fluctuation.
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