Electron-beam processed films for microelectronics structures
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United States of America Patent
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Nov 25, 2003
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N/A
app pub date -
May 23, 1996
filing date -
Jun 15, 1995
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Expired
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Abstract
An improved method for producing substrates coated with dielectric films for use in microelectronic applications wherein the films are processed by exposing the coated substrate surfaces to a flux of electron beam. Substrates cured via electron beam exposure possess superior dielectric properties, density, uniformity, thermal stability, and oxygen stability.
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