Micro BGA package
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United States of America Patent
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Nov 18, 2003
Grant Date -
Dec 19, 2002
app pub date -
May 29, 2002
filing date -
Jun 13, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A micro BGA package comprises a die, a wiring board, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The wiring board has a die-attaching surface, a surface-mounting surface with solder balls, and lateral surfaces between the die-attaching surface and the surface-mounting surface. The package body has a fastener covering and extending around the lateral surfaces of the wiring board for improving the bonding strength between wiring board and die and avoiding delamination. Preferably, the wiring board has a plurality of support bars for supporting the wiring board during molding.
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