Method of manufacturing high-power light emitting diodes
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United States of America Patent
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Nov 18, 2003
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app pub date -
Aug 20, 2002
filing date -
Aug 20, 2002
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Abstract
The present invention is related to a method of manufacturing high efficiency LEDs. The LEDs uses a metal reflection layer to solve the problem of light absorption by the substrate, and improves the illumination. It also forms a vertical structure where the P and N ends are on the top and bottom sides of the LEDs, respectively. A vertical structure is easier for final packaging. In addition, the present invention uses a metal substrate to replace the semiconductor substrate in order to improve the heat dissipation, and enable the LEDs to operate at a higher current.
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