Thermally conductive dielectric mounts for printed circuitry and semi-conductor devices and method of preparation

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United States of America Patent

PATENT NO 6649325
SERIAL NO

09865778

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Abstract

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Methods and formulations for use in preparing thermally conductive dielectric mounts for heat generating semi-conductor devices and associated circuitry. The formulations include a thermoplastic resin selected from the group consisting of polysulfone, poly-ethersulfone, poly-phenylsulfone, and poly-etherimides, with these resins being applied as a dispersion onto the surfaces of opposed metallic members. The dispersion is dried and thereafter treated under heat and pressure at temperatures greater than the glass transition temperature under unit pressures of between 100 psi and 800 psi and for periods in excess of about 30 minutes. The polymer resin may be filled with solid particulate such as alumina and/or boron nitride.

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Patent Owner(s)

Patent OwnerAddress
BERGQUIST COMPANY THE5300 EDINA INDUSTRIAL BLVD MINNEAPOLIS MN 55439

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gundale, Benjamin P St. Louis Park, MN 7 240
Misra, Sanjay Shoreview, MN 33 474

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