Compound material comprising fibers which are embedded in a thermoplastic
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United States of America Patent
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Nov 18, 2003
Grant Date -
N/A
app pub date -
Sep 18, 2000
filing date -
Sep 23, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A compound material including fibers which are embedded in a thermoplastic matrix has a free surface to be treated. The material has one or more capillary spaces extending between the fibers, which spaces are at least partly formed by communicating pores and which are open towards the free surface. An average diameter of the pores is greater than, equal to or not substantially less than the fiber diameter.
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