Wafer polishing apparatus
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United States of America Patent
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Nov 18, 2003
Grant Date -
Jan 10, 2002
app pub date -
Jul 5, 2001
filing date -
Jul 5, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A step part is formed on a face of a retainer ring that contacts with a polishing pad so that a wavily deformed part of the polishing pad enters the step part. The step part is formed like a ring at the inside of the face which actually contacts with the polishing pad. Moreover, a height of the step part is smaller than a thickness of a wafer so that a top face of the step part does not contact with the polishing pad and the wafer does not enter the step part. Further, a width of the step part is set so that the wavily deformed part of the polishing pad can enter the step part.
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