Low emission formaldehyde resin and binder for mineral fiber insulation
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United States of America Patent
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Nov 11, 2003
Grant Date -
N/A
app pub date -
Dec 17, 2001
filing date -
Jun 17, 1999
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Abstract
A phenol-formaldehyde resole resin is prepared using a high level of catalyst at a polymerization temperature of about 63.degree. C. The endpoint, measured by salt water tolerance, is selected so that the resulting resin has a water dilutability of 20:1 at neutral pH after storage for three weeks at a temperature of about 13.degree. C., with a free phenol level of no more than 0.50 percent.
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