Methods for shielding of cables and connectors
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United States of America Patent
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Nov 11, 2003
Grant Date -
Nov 15, 2001
app pub date -
Feb 16, 2001
filing date -
Apr 17, 2000
priority date (Note) -
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Abstract
The present invention provides methods for shielding a cable that comprises a plurality of conductive leads that are encapsulated by a dielectric substrate. One embodiment of the method comprises applying a metallized layer around the dielectric substrate and coupling a metallized thermoform shield around an end of the metallized dielectric substrate and conductive leads so as to create a conductive connection between the metallized thermoform shield and the metallized layer on the dielectric substrate.
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