Solid state capacitors and methods of manufacturing them
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United States of America Patent
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Nov 4, 2003
Grant Date -
N/A
app pub date -
Aug 19, 2002
filing date -
Jul 8, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The application relates to the field of solid state capacitors. The invention particularly relates to an improved method of manufacturing multiple capacitors on a substrate. According to one aspect of the present invention there is provided a method of manufacturing solid state capacitors comprising: providing an electrically conducting substrate having a plurality of apertures formed therethrough; forming plurality of porous bodies comprising valve action material on the substrate, a portion of each porous body being accommodated in an associated aperture; forming an electrically insulating layer over the free surface of the porous bodies; forming a conducting cathode layer over the electrically insulating layer applied to the porous bodies; and providing cathode termination means on an exposed underside surface of each coated porous body accommodated in the aperture, providing anode termination means on an underside surface of the substrate adjacent the aperture, the anode termination forming an electrical contact with the substrate material and the cathode termination forming an electrical contact with the cathode layer, and dividing the substrate into individual capacitor units, each comprising a porous body accommodated in an aperture-defining portion of the substrate.
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