Organosilicon composition
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United States of America Patent
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Nov 4, 2003
Grant Date -
N/A
app pub date -
Nov 14, 2001
filing date -
May 28, 1999
priority date (Note) -
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Abstract
The present invention relates to use of an inhibitor compound in an organosilicon composition for inhibiting curing of the organosilicon composition by a hydrosilylation reaction at a temperature of 40.degree. C. to 100.degree. C., or 100.degree. C. and above, and a pressure of 1.times.10.sup.6 N/m.sup.2 to 5.times.10.sup.6 N/m.sup.2, or 5.times.10.sup.6 N/m.sup.2 and above. In a preferred application the organosilicon composition cures to form a silicone gel or elastomeric seal or plug within an oil or gas well. Preferred inhibitor compound is 1-ethynyl-1-cyclopentanol or 1-ethynyl-1-cyclohexanol.
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