Method for selectively applying solder mask
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United States of America Patent
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Nov 4, 2003
Issued Date -
N/A
app pub date -
Dec 31, 2002
filing date -
Sep 11, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method is disclosed for applying solder mask to an area respective of a plurality of receiving pads on a Printed Circuit Board. The solder mask can be at least partially removed during the component removal process exposing the conductor, via and annular ring. The exposed conductor, via and annular ring can cause defects and unreliable solder joints should the solder flow along the conductor and into the via. A small stencil can be used to apply solder mask in a desirable pattern to a selective area of a PCB. Alternatively, an elastomeric transferring apparatus can be used. Various methods can be included to assist in aligning the applicator to the desired area such as an overlaid, dual imaging system.
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