Method of manufacturing printed circuit boards
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United States of America Patent
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-
Nov 4, 2003
Grant Date -
N/A
app pub date -
Jan 3, 2001
filing date -
Jan 3, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Methods of manufacturing printed circuit boards are disclosed. The methods utilize various printing techniques to apply conductive compositions to substrates in the creation of printed circuit boards. The method of manufacturing printed circuit board comprises the step of applying conductive composition to a substrate through a cold welding process.
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