Sputtering device
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United States of America Patent
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Nov 4, 2003
Grant Date -
Jun 20, 2002
app pub date -
Sep 26, 2001
filing date -
Sep 26, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is directed to a sputtering device for depositing multi-layer films on a substrate, the sputtering device comprising at least one planar-magnetron-sputtering-cathode and at least one facing-targets-sputtering-cathode housed in a single vacuum chamber, and adapted such that each planar-magnetron-sputtering-cathode and facing-targets-sputtering-cathode can be selectively positioned for sputtering deposition onto a substrate.
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