Method and apparatus for polishing the edge of a bonded wafer
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United States of America Patent
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Nov 4, 2003
Grant Date -
N/A
app pub date -
Feb 21, 2003
filing date -
Feb 21, 2003
priority date (Note) -
Expired
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Abstract
A polishing bar is provided with a plurality of backings that are carried via blocks of impact absorbent material on a bar of greater stiffness. Each backing is shaped with two surfaces at an angle to each other. A polishing tape is disposed over the angled surfaces of each backing. The portion of the polishing tape over the forward surface of the backing is employed to polish the angled edge of the top wafer of a rotating bonded wafer pair.
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