Method and apparatus for placing solder balls on a substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 4, 2003
Issued Date -
N/A
app pub date -
Feb 19, 1999
filing date -
Feb 6, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for placing spheres at predetermined positions on a substrate. The apparatus includes a platform to support the substrate at a first sphere placement position in the apparatus, and a placement station disposed above the platform that places spheres at locations on the substrate. The placement station includes a first container having a chamber to contain spheres, and a first carrier tray having a substantially horizontal upper surface that forms a lower surface of the chamber. The upper surface has a first section and a second section, the second section having a plurality of holes formed therein to receive spheres. The first carrier tray is movable to position the second section between a fill position beneath the first container and a place position disposed over the first sphere placement position. The placement station is constructed and arranged to fill the plurality of holes with spheres when the second section is in the fill position, and place the spheres at the predetermined positions on the substrate when the second section is in the place position.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully