Hybrid disk-cone extrusion die module having a spillover surface surrounding a planar seal surface
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 28, 2003
Grant Date -
Jan 30, 2003
app pub date -
Jul 27, 2001
filing date -
Jul 27, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention discloses an extrusion die module having a flat compression seal surrounded by a conical or otherwise angled spillover surface. The die module promotes a flat surface to flat surface compression seal outside of the flow distribution channels and promotes better streamlined flow and material combination than a traditional flat disk die module. The die module promotes a reduced overall diameter and wetted diameter in comparison to standard flat disk dies. In addition, the present invention relates to an extrusion die module having a spillover surface surrounding a planar sealing surface. Further, the present invention relates to a method for utilizing an extrusion die module with a conical or otherwise angled spillover surface to minimize the die surface area wetted by an intermediate layer in a multi-layer coextrusion process.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully