Rapid surface cooling of solder droplets by flash evaporation
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United States of America Patent
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-
Oct 21, 2003
Grant Date -
May 30, 2002
app pub date -
Aug 31, 2001
filing date -
Sep 1, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A mist of liquid coolant is introduced into the path of atomized, molten, solder droplets. The mist and other conditions within the chamber are engineered to enable the liquid coolant droplets in the mist to contact the surfaces of molten solder droplets and be flash vaporized upon contact, thereby rapidly extracting heat from the molten solder droplets and accelerating cooling and solidification to produce an enhanced solder ball as a product of this process.
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