Bonding system having adherence to low energy surfaces
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United States of America Patent
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Oct 14, 2003
Grant Date -
N/A
app pub date -
Mar 12, 2002
filing date -
Mar 12, 2002
priority date (Note) -
Expired
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Abstract
The present invention is directed to (meth)acrylate compositions useful for bonding substrates including metals, plastics, and glass to similar or different substrates, in particular, low energy surfaces. The invention also provides an initiator system for (meth)acrylate based adhesives; a kit for bonding substrates, at least one of which includes a low energy surface; a resultant bonded assembly; and a method of bonding low energy substrates. A (meth)acrylate composition within the present invention includes a (meth)acrylate component and an initiator system including an organometallic compound, a peroxy compound, an aziridine functionalized compound, and a compound having an acid functional group.
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