Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
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United States of America Patent
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Oct 14, 2003
Grant Date -
May 16, 2002
app pub date -
Nov 19, 2001
filing date -
May 28, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a toughened thermosetting resin composition useful as an underfilling sealant composition which fills the underfill space in a semiconductor device, and includes a semiconductor chip mounted on a carrier substrate, enabling the semiconductor device to be securely connected to a circuit board by short-time heat curing. The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a cyanate ester component and an imidazole component.
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