Method of forming via-holes in multilayer circuit boards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 14, 2003
Grant Date -
N/A
app pub date -
Nov 22, 2000
filing date -
Aug 24, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention discloses a method of forming via-holes in multilayer circuit boards. The process includes forming covering substances in predetermined spots in a multilayer circuit board and thereafter applying an insulating layer upon the circuit board. The predetermined spots are then uncovered and the covering substances are removed to form via-holes.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully