Machine for grinding-polishing of a water edge
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United States of America Patent
Stats
-
Oct 7, 2003
Grant Date -
Aug 2, 2001
app pub date -
Dec 19, 2000
filing date -
Jan 28, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The wafer edge processing unit may be a stand alone unit or may be incorporated in existing grinding machines. The processing unit employs a plurality of tapes which are coated with differing grades of grit to sequentially polish the edge of a rotating wafer or to remove an edge bead from a processed wafer or the other substrate. The tapes are mounted on a backing block which is rotated to move the tapes from a line contact with the top bevel of the wafer to a line contact with the bottom bevel of the wafer. Fresh surfaces of the tapes are presented to successive wafers by rotating the spools on which the tapes are mounted. The wafer may be moved in small increments along a Y-axis and/or an X-axis relative to a tape during polishing to improve the polishing operation.
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