Reworkable thermosetting resin compositions and compounds useful therein
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Sep 30, 2003
Grant Date -
N/A
app pub date -
Sep 5, 2000
filing date -
Sep 5, 2000
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Expired
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Abstract
Curable compositions, reaction products of which are reworkable through thermal decomposition, are provided. Specific compounds useful in such curable compositions, as well as curable compositions and thermosets incorporating such compounds, are provided in the present invention. The compounds include a cyclic hydrocarbon moiety including an oxirane or thiirane group and an aromatic ether moiety including an oxirane or thiirane group. The cyclic hydrocarbon moiety and the aromatic ether moiety are joined to each other through an oxycarbonyl-containing linkage or a thiocarbonyl-containing linkage, preferably a secondary or tertiary linkage. Compositions incorporating such compounds are capable of curing by exposure to a specific temperature, and are decomposable at a temperature in excess of the curing temperature, thus providing a composition which is reworkable.
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