Release film
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United States of America Patent
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Sep 30, 2003
Grant Date -
Jan 24, 2002
app pub date -
Apr 3, 2001
filing date -
Apr 4, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention relates to a release film comprising: a polyester film; a coating layer formed on one surface of said polyester film; and a release layer formed on a surface of said coating layer which exhibits a residual adhesion rate of not less than 80%, said release film satisfying all of the conditions represented by the following formulae (1) to (3): OL.ltoreq.0.6 (1) TL.gtoreq.80 (2) TL(H).ltoreq.8 (3) wherein OL is an amount (mg/m.sup.2) of oligomers extracted with dimethylformamide from a surface of said release layer after the release film is heat-treated at a temperature of 180.degree. C. for 10 minutes; TL is a total light transmittance (%) of said release film; and TL(H) is a total light transmittance (%) of a laminate prepared by interposing said release film between two polarizing plates disposed in a perpendicular relation to each other.
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