Diamond tool

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6626167
APP PUB NO 20030089364A1
SERIAL NO

09989600

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A segment type diamond tool, used for cutting or drilling brittle substances, such as stones, bricks, concrete structures, or asphalt structures, is disclosed. In the diamond tool, the segments are each set with diamonds in a single-layered structure or a multi-layered structure, and are alternately or intermittently arranged on a steel core, different from conventional diamond tools having segments randomly set with diamonds. Such a diamond arrangement of this invention allows the diamonds to more effectively perform their cutting action, and so the diamond tool has an increased cutting rate, in addition to reducing the amount of fine debris generated during a cutting or drilling process to ill-affect worker's health or cause environmental pollution. In the segments each set with diamonds in the single-layered or multi-layered structure, the diamond arrangement is designed such that the diamonds of each trailing segment form grooves on the surface of a brittle substance along the lands between grooves previously formed on the surface of the brittle substance by the diamonds of a leading segment.

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Patent Owner(s)

Patent OwnerAddress
EHWA DIAMOND INDUSTRIAL CO LTDGYEONGGI DO SOUTH KOREA
GENERAL TOOL INC2025 ALTON PARKWAY IRVINE CA 92606

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Jong Ho Seoul, KR 282 2851
Kim, Soo Kwang Irvine, CA 9 143
Yoon, So Young Seoul, KR 35 276

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