Semiconductor circuit device having power and ground lines adapted for high-frequency operation
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United States of America Patent
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Sep 23, 2003
Grant Date -
Jan 24, 2002
app pub date -
Jul 10, 2001
filing date -
Jul 11, 2000
priority date (Note) -
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Abstract
In a semiconductor chip are arranged power pads, ground pads and signal pads. A ground line is provided which is formed as one in the vicinity of the chip and branches off at some distance from the chip. Signal lines and power lines are each formed over one of the branched ground lines. The signal lines and the power lines are extended radially together with the underlying ground lines. Each of the signal lines and the power lines are extended together with the corresponding ground line to form a stacked pair line.
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