Thin film shape memory alloy actuated microrelay
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United States of America Patent
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Sep 23, 2003
Grant Date -
May 16, 2002
app pub date -
Mar 28, 2001
filing date -
Mar 28, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A microrelay device formed on a silicon substrate wafer for use in opening and closing a current path in a circuit. A pair of electrically conducting latching beams are attached at their proximal ends to terminals on the substrate. Proximal ends of the beams have complementary shapes which releasably fit together to latch the beams and close the circuit. A pair of shape memory alloy actuators are selectively operated to change shapes which bend one of the beams in a direction which latches the distal ends, or bend the other beam to release the distal ends and open the circuit. The microrelay is bistable in its two positions, and power to the actuators is applied only for switching it open or closed.
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