EMI containment apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Sep 23, 2003
Grant Date -
N/A
app pub date -
Oct 6, 2000
filing date -
Oct 12, 1999
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An EMI and RFI shield mounting system includes a compartmented EMI shield constructed of a vacuum metallized thermoform having upright hollow walls separating and surrounding the compartments. The shield conforms to the interior of a housing for electronic equipment, with the upright walls overlying ridges formed in the interior of the housing. A compressible gasket is placed between the ridges of the housing and the inner reaches of the hollow walls of the shield. The free sides of the walls of the shield may be abutted against ground traces on a printed circuit board on which the shield and housing are placed. The gasket urges the metallized free edges of the walls of the shield against the ground trace of the printed circuit board to provide electrical conductivity between the printed circuit board and the shield. Dimples, tabs or protruding punctures may be formed in the free sides of the walls to ensure conductive contact with the ground trace.
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