Connector with base having channels to facilitate surface mount solder attachment
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Sep 23, 2003
Issued Date -
N/A
app pub date -
Dec 20, 2001
filing date -
Mar 8, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A surface mount connector for circuit board attachment is provided in the form of an elongate pin with a head or base formed at the lower end of the pin. The base has a bottom surface that extends substantially normal to the axis of the pin and is dimensioned to be positioned on, and soldered to, a pad on a primary circuit board. A solder bond is achieved by re-flowing a quantity of solder applied to the pad along with a quantity of flux before placing the base on top of the quantity of solder. The base is formed with a plurality of channels that open through the bottom surface and through a peripheral wall of the base for permitting gases generated by vaporizing the flux during solder re-flow to escape from underneath the base and to increase the strength of the solder bond between the pad and the base. Exhaustion of the gases prevents undesirable skating of the connector and misalignment and eliminates voids in the solder bond that would otherwise weaken the bond.
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