Sensor including a circuit lead frame and a terminal lead frame formed by a metal plate
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United States of America Patent
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-
Sep 16, 2003
Grant Date -
Aug 1, 2002
app pub date -
Jan 31, 2002
filing date -
Feb 1, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A pressure sensor (1) has a circuit board (5) having a circuit portion (11) for amplifying an electric signal detected by a pressure detecting element (2C) and attached with an IC die (16), and a terminal (12) for inputting and outputting the electric signal from the circuit portion (11). The circuit portion (11) and the terminal (12) have a frame (11A, 12D) formed by a metal plate, the metal plate being provided with resin molds (14, 15). The circuit portion (11) and the terminal (12) are continuously formed, so that steps for soldering etc. is not necessary.
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