Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners
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United States of America Patent
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Sep 9, 2003
Grant Date -
May 16, 2002
app pub date -
Nov 19, 2001
filing date -
Dec 17, 1999
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Expired
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Abstract
Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, a curative based on the combination of nitrogen containing compounds and transition metal complexes, and a polysulfide toughening agent.
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