Metal laminate for a circuit board
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United States of America Patent
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Sep 9, 2003
Grant Date -
N/A
app pub date -
Mar 27, 2000
filing date -
Mar 29, 1999
priority date (Note) -
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Abstract
A method of producing a metal laminate for a circuit board includes a first step of press-bonding a thermotropic liquid crystal polymer film 1 having a segment orientation ratio SOR within a range not smaller than 0.90 and smaller than 1.15 along the longitudinal direction of the film, to a metal sheet 3 between hot rolls while the thermotropic liquid crystal polymer film 1 is in a tense or non-tense state; and a second step of heating the laminate obtained in the first step to a temperature not lower than the melting point of the thermotropic liquid crystal polymer film.
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