Integral capacitance for printed circuit board using dielectric nanopowders
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United States of America Patent
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Sep 9, 2003
Grant Date -
Nov 15, 2001
app pub date -
May 4, 1999
filing date -
May 4, 1998
priority date (Note) -
Expired
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Abstract
A method for producing integral capacitance components for inclusion within printed circuit boards. Hydrothermally prepared nanopowders permit the fabrication of a very thin dielectric layers that offer increased dielectric constants and are readily penetrated by microvias. Disclosed is a method of preparing a slurry or suspension of a hydrothermally prepared nanopowder and solvent. A suitable bonding material, such as a polymer is mixed with the nanopowder slurry, to generate a composite mixture which is formed into a dielectric layer. The dielectric layer may be placed upon a conductive layer prior to curing, or conductive layers may be applied upon a cured dielectric layer, either by lamination or by metallization processes, such as vapor deposition or sputtering.
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