High temperature ceramic heater assembly with RF capability
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United States of America Patent
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Sep 9, 2003
Grant Date -
Mar 20, 2003
app pub date -
Mar 27, 1998
filing date -
Feb 12, 1997
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Abstract
The present invention provides techniques for coupling radio-frequency (RF) power to a metal plate in a ceramic pedestal. Perforations in the metal plate allow ceramic-to-ceramic bonding through the metal plate. The power from an RF power feed is distributed to the perforated metal plate via several electrodes that are spaced away from the centerline of the RF power feed, thus splitting power distribution. A ceramic bonding disk between the metal plate and the RF power feed provides mechanical support for the metal plate and a ceramic body to bond to through the perforations, thus reducing cracking of the metal plate and the surrounding ceramic material.
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