Method of manufacturing IC cards
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United States of America Patent
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Sep 2, 2003
Grant Date -
N/A
app pub date -
Feb 16, 2001
filing date -
Aug 19, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A IC card producing method includes testing steps which can enhance the reliability and generality of IC cards. The method of producing IC cards of the non-contact type or contact type implements a wafer processing step (step 100), wafer inspection step (step 200), COB fabrication step (step 300), COB on-card mounting step (step 400), IC card production process 0th-order issuance step (step 500), IC card inspection step (step 600), 1st-order issuance processing step (step 700), and 2nd-order issuance processing step (step 800) to complete a contact-type IC card. Particularly, the method includes the chip testing of step 200 and IC card testing of steps 500-800 for the IC card in its state having a tested chip. The method further adopts a dual testing scheme which includes a memory verification test conducted inside the internal memory, such as an EEPROM, concurrently with the IC card test by the tester.
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