Method and system for manufacturing electronic packaging units
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United States of America Patent
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Sep 2, 2003
Issued Date -
N/A
app pub date -
Nov 20, 2000
filing date -
Oct 15, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and system for fabricating electronic packaging units which include a molded body and a plurality of electrically conductive leads protruding therefrom. The packaging units are made by overlaying lead frames having leads and then depositing molding material on the leads. The packaging units are manufactured in an assembly line process which includes a feeder to feed the lead frames and a molder to deposit the molding material.
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