Cup-type plating apparatus and method for plating wafers
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United States of America Patent
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-
Aug 26, 2003
Grant Date -
Jun 6, 2002
app pub date -
Jun 18, 2001
filing date -
Dec 5, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present cup-type plating apparatus improves a conventional cup-type plating apparatus and prevents the surface of a wafer due to a mist of the plating solutions from being contaminated. A plating solution is supplied to a wafer which is placed on a wafer support provided along an opening at the top of a plating tank from a solution-supply port provided at the bottom of the plating tank by an upward-moving stream; the plating solution is made to flow out of a solution-outlet port provided for the plating tank; and plating is performed while the plating solution is brought into contact with a surface of the placed wafer, which is to be plated, wherein the solution-outlet port has a solution-outlet path in which the discharged plating solution is isolated from the outer space.
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