Dielectric material including particulate filler
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United States of America Patent
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Aug 19, 2003
Grant Date -
Nov 1, 2001
app pub date -
Dec 9, 1999
filing date -
May 4, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A dielectric substrate useful in the manufacture of printed wiring boards is disclosed wherein the dielectric substrate comprises at least one organic polymer having a T.sub.g greater than 140.degree. C. and at least one filler material. The dielectric substrate of this invention has a dielectric constant that varies less than 15% over a temperature range of from -55 to 125.degree. C.
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