Method of manufacturing semiconductor devices and semiconductor devices made according to the method
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United States of America Patent
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Aug 19, 2003
Grant Date -
Nov 15, 2001
app pub date -
Feb 21, 2001
filing date -
Feb 21, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of manufacturing semiconductor devices. The method includes the steps of: providing a lead frame assembly having oppositely facing first and second sides; mounting a first semiconductor chip on the first side of the lead frame assembly; mounting a second semiconductor chip on the second side of the lead frame assembly; electrically connecting the first semiconductor chip to a first lead on the lead frame assembly; electrically connecting the second semiconductor chip to a second lead on the lead frame assembly; applying sealing resin to the first and second sides of the lead frame assembly with the first and second semiconductor chips mounted thereon; and after applying sealing resin, separating the lead frame assembly into first and second semiconductor devices. The first semiconductor device consists of a first portion of the lead frame assembly, the first semiconductor chip thereon, and the first lead electrically connected to the first semiconductor chip. The second semiconductor device consists of a second portion of the lead frame assembly, the second semiconductor chip thereon, and the second lead electrically connected to the second semiconductor chip.
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