Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same

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United States of America Patent

PATENT NO 6606237
SERIAL NO

10180629

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Abstract

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A multilayer capacitor is constructed to minimize equivalent series inductance (ESL) and to achieve large capacitance. The capacitor includes first and second main go surface terminal electrodes provided on a first main surface of the main body of the multilayer capacitor. First and second side surface terminal electrodes are disposed on four side surfaces of the main body. The main body is divided into a low ESL section of the first main-surface side and a high capacitance section of the second main-surface side. In the low ESL section, in addition to first and second low ESL internal electrodes, a first conductive via-hole electrically connecting the first low ESL internal electrode to the first main surface terminal electrode and a second conductive via-hole electrically connecting the second low ESL internal electrode to the second main surface terminal electrode are provided. In the high capacitance section, in addition to first and second high capacitance internal electrodes, a first leading electrode electrically connecting the first high capacitance internal electrode to the first side surface terminal electrode and a second leading electrode electrically connecting the second high capacitance internal electrode to the second side surface terminal electrode are provided.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054
MURATA MANUFACTURING CO LTDKYOTO JAPAN KYOTO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Figueroa, David G Mesa, AZ 58 1325
Hioki, Takashi Tsukuba, JP 1 145
Holmberg, Nicholas L Gilbert, AZ 9 248
Hori, Haruo Sabae, JP 20 788
Kuroda, Yoichi Fukui, JP 57 1877
Naito, Yasuyuki Otsu, JP 118 3378
Rodriguez, Jorge P Portland, OR 23 328
Taniguchi, Masaaki Fukui-ken, JP 62 1976
Watts, Nicholas R Phoenix, AZ 22 478

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