Abrasive article having a window system for polishing wafers, and methods
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United States of America Patent
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Aug 12, 2003
Issued Date -
N/A
app pub date -
Nov 7, 2002
filing date -
Nov 29, 2000
priority date (Note) -
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Abstract
A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.
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