Method for producing a tin-nickel alloy film
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United States of America Patent
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-
Aug 5, 2003
Grant Date -
Apr 25, 2002
app pub date -
May 23, 2001
filing date -
Oct 24, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A tin layer and a nickel layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the nickel layer. Then, the multilayered film is heated to a given temperature to form a tin-nickel alloy film through the diffusion of the tin elements of the tin layer into the nickel layer.
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