Pad support apparatus for chemical mechanical planarization
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United States of America Patent
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-
Aug 5, 2003
Grant Date -
N/A
app pub date -
Oct 20, 2000
filing date -
Oct 28, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A system for chemical mechanical planarization comprises a platen assembly for holding an object to be planarized and a polishing head comprising a puck holder assembly for coupling to a substrate for holding a polishing pad. The polishing pad is smaller in surface area than the object. The polishing head is movable from a first region overlying the platen assembly to a second region. The puck holder assembly comprises a backing surface for positioning the substrate, and a clamp ring positioned proximate to the backing surface for supplying mechanical force to the substrate to hold the substrate in place during a polishing operation. A spring mechanism is disposed in the housing for resiliently biasing the clamp ring toward the substrate.
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