Method for producing micro-openings
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 5, 2003
Grant Date -
N/A
app pub date -
Mar 26, 2001
filing date -
Aug 28, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The invention concerns methods for the production of micro-holes in semi-finished components (300) for printed circuit boards (200), consisting of several layers of electrically conductive materials (21,22) and dielectric materials (20), wherein micro-holes are embossed into dielectric materials and/or electrically conductive materials and that the embossed micro-holes are subsequently cleaned by means of plasma or by means of wet-chemical processes
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully