Structure of a pin platform for integrated circuit
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United States of America Patent
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Jul 29, 2003
Grant Date -
Jul 17, 2003
app pub date -
May 6, 2002
filing date -
Jan 16, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
An improved structure of a pin platform of an integrated circuit having a pin platform body including a chip seat and a plurality of leading plates having their end portions being concentrated on the chip seat and the chip seat being connected to the pin platform body via the connection plate, characterized in that the surrounding of the chip seat is provided with a framing side, and the framing side is connected to a connection plate, and the surface of the chip seat is smaller than the connection surface of the IC to be installed, and the size of the framing side is larger than the size of the connection face of the IC. Therefore, a high performance greenery package is obtained and the ground wire of the IC can be soldered to the framing side, which provides a smooth connection and a communication.
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